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Articles

Forecasting Failure: By Determining Chip Quality at the Nanoscopic Level, DMEA may Avert Disaster.
Wouldn't it be great if a microchip could be analyzed for reliability without all the messy, lengthy field testing? Maybe, thanks to research being done at DMEA, it can.

Cool in a Box: COTS goes rugged quickly with help from DMEA partnership.
How do you get a lot of heat out of a chip?

How can it be done efficiently and inexpensively?

The Department of Defense is asking these questions as it looks for ways to use advanced Commercial-Off-The-Shelf (COTS) technology in harsh military environments without waiting for traditional re-engineering or risking failure of over-heated, damaged computer-based systems.

Little Eyes Everywhere

DMEA MicroSensors Transfer Commercial Technology to Wartime Uses

How do you monitor activity in a foreign environment without people knowing they are being observed or watch for intruders over a vast area with a limited force? DMEA’s answer to these questions is unattended microsensors.

 

 

Conference Proceedings and Presentations

September 3, 2008, Washington DC

CSPAN Video
DMEA Director Presents at COMDEF International Forum (DMEA presentation begins at the 1 hour and 8 minute [1:08:00] mark of the video)

Forbes.com
Business in The Beltway: Pentagon Worries about Chinese Chips

March 25-28, 2002, New Orleans, LA

Proceedings

Tutorial, Session 1

Tutorial, Session 2, How to Manage DMSMS

Tutorial, Session 3, Misc. Technology Issues

August 22-24, 2000, Ponte Vedra Beach, FL

Proceedings

April 20-22, 1999, Monterey, CA

Proceedings

 

 

Government/Industry Microelectronics DMSMS Workshop Minutes

May 3, 2001, Folsom, CA

Minutes

August 25, 2000, Ponte Vedra Beach, FL

Minutes

October 14, 1999, Orlando, FL

Minutes

 

 

Reports

Resolution Cost Factors for Diminishing Manufacturing Sources and Material Shortages, Final Report, (Table 2-3 for this document is located here),1999 and Supplemental Report, 2001

 

 

Surveys

No new surveys at this time.

 

Handbooks/Guidelines

Program Managers Handbook—Common Practices to Mitigate the Risk of Obsolescence

DoD DMSMS Guidebook

DMSMS Management Practices

DMSMS Acquisition Guidelines, Implementing Parts Obsolescence Management Contractual Requirements

FY10 Small Business Prime Contracting

Every year DMEA reports the extent of small business prime contracting to the Department of Defense Office of Small and Disadvantaged Business Utilization, within the Office of the Secretary of Defense. Our most recent report covered fiscal year 2010, and for the eighth year in a row it was very encouraging for small business. Small businesses were awarded 36% of DMEA’s prime contracts, which far exceeded our established goal.

DMEA is accrediting authority for the Trusted IC Supplier Accreditation Program.
The Defense MicroElectronics Activity (DMEA) has been designated by the Department of Defense through the Trusted Access Program Office (TAPO) as the accrediting authority for this program.

CSPAN Video
DMEA Director Presents at COMDEF International Forum
(DMEA presentation begins at the 1 hour and 8 minute [1:08:00] mark of the video)

Forbes.com
Pentagon Worries about Chinese Chips
DMEA Transfers to DDR&EThe Honorable Ken Krieg USD (AT&L) has transferred the Defense Microelectronics Activity to the Director, Defense Research and Engineering. This transfer acknowledges the increased significance of microelectronics technology to the DoD which has led to a broadened demand for DMEA’s unique technical and engineering capabilities in microelectronics and emerging technologies. DMEA’s distinctive resources are being utilized to meet DoD’s requirements across the entire spectrum of technology development, acquisition, and long term support. In meeting those needs, DMEA’s unique services are requested throughout the DoD, other Government Agencies, Industry, and Allied nations.

DMEA Director Selected as Winner of the Federal Laboratory Consortium's Laboratory Director of the Year
Congratulations letter from the Secretary of Defense, Washington, The Honorable Donald Rumsfeld, attached.

On May 4th, 2005, Ted Glum, Director of the Defense Microelectronics Activity (DMEA) located at McClellan Park, California was awarded the Federal Laboratory Consortium (FLC) Laboratory Director of the Year at the FLC 2005 conference in Orlando, Florida. [GovLink Review Article Volume 5, Issue 2]

Little Eyes Everywhere
DMEA MicroSensors Transfer Commercial Technology to Wartime Uses
How do you monitor activity in a foreign environment without people knowing they are being observed or watch for intruders over a vast area with a limited force? DMEA’s answer to these questions is unattended microsensors.

ATSP3 Task Order Contract (program value $4.7B) offers rapid access (4-10 weeks) to pre-qualified contractors, access to DMEA contracting experts, and a streamlined procurement process.

DMEA DIRECTOR SPEAKS BEFORE BRITISH INDUSTRY & GOVERNMENT GROUP
Mr. Ted Glum (DMEA Director) was the invited speaker at the distinguished Royal United Services Institute (RUSI) for Defence and Security Studies at Whitehall in London, UK.

Ground Breaking Integrated Circuit Evaluation Work (Reliability Construction Analysis)
Provides a quantitative method of predicting the lifetime of COTS IC's when used in other than commercial applications--especially when used in military applications.

Forecasting Failure: By Determining Chip Quality at the Nanoscopic Level, DMEA may Avert Disaster.
Wouldn't it be great if a microchip could be analyzed for reliability without all the messy, lengthy field testing? Maybe, thanks to research being done at DMEA, it can.

Cool in a Box: COTS goes rugged quickly with help from DMEA partnership.
How do you get a lot of heat out of a chip?

How can it be done efficiently and inexpensively?

The Department of Defense is asking these questions as it looks for ways to use advanced Commercial-Off-The-Shelf (COTS) technology in harsh military environments without waiting for traditional re-engineering or risking failure of over-heated, damaged computer-based systems.

FY04 Summary of DMEA’s Small Business Prime Contracting

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GovLink Review Article Volume 5, Issue 2]

Ted Glum receives award cont
[GovLink Review Article Volume 5, Issue 2]
Congratulations letter from Donald Rumsfeld

Director Speaks Before British Industry & Government Group

Mr. Ted Glum was the invited speaker at the distinguished Royal United Services Institute (RUSI) for Defence and Security Studies at Whitehall in London. The event, called the “Whitehall Dialogue”, focused specifically on present and future issues facing critical microelectronics technology found within defense systems. Mr. Glum described to the audience of government and industry executives, the challenges they and their organizations will face, and must ultimately overcome, due to the rapid pace of microelectronics technology evolution. Stressing cooperation, Mr. Glum then outlined several efforts being undertaken by the US Defense Microelectronics Activity (DMEA) to address these issues, including a joint research program between DMEA and BAE SYSTEMS in Edinburgh.

 

Information regarding the United Services Institute can be found at: http://rusi.org/

Reliability Construction Analysis

Integrated circuit fabrication technology has rapidly progressed in the last ten years. The recent five years have seen monumental changes in how ICs are designed and manufactured. The reality
for commercial (COTS) ICs is such that new generations emerge in as short of time of fourteen months or less. At this point in time, manufacturers are predicting and designing for component lifetimes of ten years or less for commercial applications. ICs which in the past had seemingly infinite lifetimes now have bounded lifetimes. While this is not a significant problem for commercial applications, it has serious implications for ICs used in military systems and in harsh environmental applications.
This IC evaluation work aims to provide a quantitative method of predicting the lifetime of COTS ICs when used in other than commercial applications--especially when used in military applications. Of the numerous IC failure mechanisms, this work focuses on electromigration and metal interconnect degradation through the use of electron backscatter diffraction (EBSD) analysis in the scanning electron microscope (SEM). Through the use of EBSD analysis, the effects of accelerated stressing of interconnects can be measured and quantified as a basis for lifetime prediction.

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Small Business Prime Contracting

Every year DMEA reports the extent of small business prime contracting to the Department of Defense Office of Small and Disadvantaged Business Utilization, within the Office of the Secretary of Defense. Our most recent report covered fiscal year 06, and for the fourth year in a row, it was very encouraging for small business. The participation by small businesses in DMEA prime contracting was 10.4% of all acquisition. Once again that figure far exceeded our established goal. Within the small business category are several smaller subcategories, our largest being Small Disadvantaged Businesses (SBD).

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This Library is intended to provide a set of comprehensive document resources about DMSMS. If you have a publication that you think would be an important addition to this resource, please contact us at:

librarian@dmea.osd.mil

Thank you.

 
Copyright 2001-2002 DMEA. All rights reserved.